AI Compute. Reimagined.
Our Smart Substrate™ uses cutting-edge chiplet integration technology that eliminates an interposer to overhaul AI & HPC systems from the ground-up.
The Substrate is your System
beyond Moore's Law
In a world where the gains from transistor scaling are increasingly marginal,
our pioneering approach using advanced packaging meaningfully scales system performance to address the most demanding computing applications of the future.
Faster external IO
Increased die-to-die bandwidth with
denser, faster on-package interconnects
Faster high-speed IO to external
compute modules & peripherals
Improved power integrity and
total system power