Current Openings
SI/PI Member of Technical Staff
Austin, TX
Full time
Chipletz is seeking SI/PI Engineers to join our Technical Staff. Candidates for this position should have a proven track record in Signal and Power integrity analysis including leading high speed transmission line designs and leading package designers for the development of both products and advanced development vehicles that are pushing state of the art substrate package technology.
All candidates must have a minimum of 5+ years of experience with a B.S. in Engineering or 3 + years of experience with an advanced degree and have a solid background in electromagnetics, microwave theory, transmission line, power distribution networks and a detailed understanding of S-parameter, Z-parameter and Fournier transform (FFT). In addition, we ask that all engineers have an in depth knowledge of I/O buffer IBIS Power-Aware modeling, equalization techniques such as FIR, CTLE, DFE, FFE and optimization of EQ settings. Our ideal person can work cross-functionally, partner with internal and external organizations and work directly with substrate suppliers to optimize materials and processes.
Tools frequently used in this role include Cadence suite, ANSYS HFSS/3D, ANSYS SIWave, Synopsys HSPICE, MSO/DSO, BERT, TDR, VNA, Spectrum Analyzer and Probe Station, as well as, C/C++/Perl/Python programming.
This is an Austin based role but remote is possible. Expect some domestic travel.
Package Designer
Austin, TX
Full time
Role
Responsible for new product package design, verification, and validation. Member of an advanced packaging team, focused on developing new technologies for heterogeneous packages. Defines test chip/test vehicle strategy to qualify new technology building blocks. Partners with internal and external organizations to optimize design and analyze performance vs yield trade-off. Drive technology design rules with ecosystem partners and support package design, SI/PI studies on new packaging concepts to drive advanced packaging technologies to support new Chipletz products.
The Person
The candidate should have a proven track record in developing board or package design rules with ecosystem partners as well as hands on experience in test chip and general understanding of substrate design. He/she should be able to leverage a deep expertise in board design or already possess a deep understanding of substrate design to complete the package design tasks. The candidate should have excellent verbal and written communication skills to articulate ideas to technology partners, colleagues, and product architects. Expect some domestic travel.
Key Responsibilities
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Design and develop advanced packaging technologies for Chipletz products
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Define and implement design for manufacturing/design for yield (DFM/DFY) guidelines
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Ability to drive cost and SI/PI assessment based on design
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Test chip, test vehicle design support
Minimum Experience
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Experience with Cadence APD/Allegro, AutoCAD
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5yrs experience with B.S. in Engineering or 4yrs experience with Master of engineering
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Experience with scripting tools such as VBS, SKILL, Python, etc.
Preferred Experience
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Defining and implementing advanced design rules as well as DFM/DFY rules
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Demonstrated leadership mentoring others
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Working directly with OSATs and substrate vendors