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Current Openings

Project Manager

Austin, TX

Full time

As a Project Manager at Chipletz, you will play a crucial role in orchestrating the successful development and delivery of our innovative Smart Substrate™ products. Working closely with cross-functional teams, you will drive projects from conception to completion, ensuring they are delivered on time, within scope, and in alignment with quality standards. You will have the opportunity to lead and inspire teams, navigate complex challenges and contribute to the advancement of groundbreaking technology.

Responsibilities:

Project Planning and Execution: Lead the planning, execution, and monitoring of projects related to Smart Substrate™ product development, ensuring adherence to timelines, budgets, and quality standards.

Cross-Functional Collaboration: Collaborate closely with engineering, manufacturing, marketing, and other teams to align project objectives, resources, and priorities.

Risk Management: Identify, assess, and mitigate project risks, proactively addressing potential obstacles to project success.

Stakeholder Communication: Serve as a primary point of contact for project stakeholders, providing regular updates on project status, milestones, and potential impacts.

Resource Allocation: Allocate resources effectively, optimizing team productivity and ensuring the efficient utilization of company resources.

Quality Assurance: Oversee the implementation of quality assurance processes and procedures, ensuring that deliverables meet or exceed customer expectations.

Continuous Improvement: Drive continuous improvement initiatives within project management processes, identifying areas for optimization and implementing best practices.

Documentation and Reporting: Maintain comprehensive project documentation, including project plans, schedules, budgets, and status reports, and provide regular reports to senior management.

Qualifications:

Bachelor's Degree: A bachelor's degree in engineering, computer science, business administration, or a related field.

Project Management Experience: Proven experience in project management, preferably in the semiconductor industry or a related technology field.

Technical Knowledge: Familiarity with semiconductor technology, packaging techniques, and related engineering concepts is highly desirable.

Leadership Skills: Strong leadership abilities with the ability to motivate and inspire cross-functional teams to achieve project objectives.

Communication Skills: Excellent communication skills, with the ability to effectively communicate complex technical concepts to both technical and non-technical stakeholders.

Problem-Solving Skills: Exceptional problem-solving abilities with a proactive and analytical approach to addressing challenges.

Organizational Skills: Strong organizational skills with the ability to manage multiple projects simultaneously and prioritize tasks effectively.

Adaptability: Ability to thrive in a fast-paced, dynamic environment and adapt quickly to changing priorities and requirements.

Join Chipletz and be part of a dynamic team that is shaping the future of semiconductor technology. If you are passionate about innovation, thrive in a collaborative environment, and are excited about pushing the boundaries of what's possible, we want to hear from you!

SI/PI Member of Technical Staff

Austin, TX

Full time

Chipletz is seeking SI/PI Engineers to join our Technical Staff. Candidates for this position should have a proven track record in Signal and Power integrity analysis including leading high speed transmission line designs and leading package designers for the development of both products and advanced development vehicles that are pushing state of the art substrate package technology.  

All candidates must have a minimum of 5+ years of experience with a B.S. in Engineering or 3 + years of experience with an advanced degree and have a solid background in electromagnetics, microwave theory, transmission line, power distribution networks and a detailed understanding of S-parameter, Z-parameter and Fournier transform (FFT).  In addition, we ask that all engineers have an in depth knowledge of I/O buffer IBIS Power-Aware modeling, equalization techniques such as FIR, CTLE, DFE, FFE and optimization of EQ settings. Our ideal person can work cross-functionally, partner with internal and external organizations and work directly with substrate suppliers to optimize materials and processes. 

Tools frequently used in this role include Cadence suite, ANSYS HFSS/3D, ANSYS SIWave, Synopsys HSPICE, MSO/DSO, BERT, TDR, VNA, Spectrum Analyzer and Probe Station, as well as, C/C++/Perl/Python programming.   

 

This is an Austin based role but remote is possible. Expect some domestic travel.

Package Designer

Austin, TX

Full time

Role  

Responsible for new product package design, verification, and validation.  Member of an advanced packaging team, focused on developing new technologies for heterogeneous packages. Defines test chip/test vehicle strategy to qualify new technology building blocks. Partners with internal and external organizations to optimize design and analyze performance vs yield trade-off. Drive technology design rules with ecosystem partners and support package design, SI/PI studies on new packaging concepts to drive advanced packaging technologies to support new Chipletz products.  

 

The Person

The candidate should have a proven track record in developing board or package design rules with ecosystem partners as well as hands on experience in test chip and general understanding of substrate design. He/she should be able to leverage a deep expertise in board design or already possess a deep understanding of substrate design to complete the package design tasks.  The candidate should have excellent verbal and written communication skills to articulate ideas to technology partners, colleagues, and product architects.   Expect some domestic travel. 

Key Responsibilities  

  • Design and develop advanced packaging technologies for Chipletz products 

  • Define and implement design for manufacturing/design for yield (DFM/DFY) guidelines 

  • Ability to drive cost and SI/PI assessment based on design 

  • Test chip, test vehicle design support 

 

Minimum Experience 

  • Experience with Cadence APD/Allegro, AutoCAD 

  • 5yrs experience with B.S. in Engineering or 4yrs experience with Master of engineering 

  • Experience with scripting tools such as VBS, SKILL, Python, etc.  

Preferred Experience 

  • Defining and implementing advanced design rules as well as DFM/DFY rules 

  • Demonstrated leadership mentoring others 

  • Working directly with OSATs and substrate vendors   

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