Current Openings
SI/PI Member of Technical Staff
Austin, TX
Full time
Duties: The individual should have a proven track record in Signal and Power Integrity (SI/PI) analysis, including leading high-speed transmission line designs and guiding package designers in the development of both cutting-edge products and advanced development vehicles that drive state-of-the-art substrate package technology.
Requirements: Minimum of 5+ years of experience with a B.S. in Engineering or 3 + years of experience with an advanced degree; Have a solid background in electromagnetics, microwave theory, transmission line, power distribution networks and a detailed understanding of S-parameter, Z-parameter and Fournier transform (FFT). An in-depth knowledge of I/O buffer IBIS Power-Aware modeling, equalization techniques such as FIR, CTLE, DFE, FFE and optimization of EQ settings. Can work cross-functionally, partner with internal and external organizations and work directly with substrate suppliers to optimize materials and processes.
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Qualifications: Experience with Cadence suite, ANSYS HFSS/3D, ANSYS SIWave, Synopsys HSPICE, MSO/DSO, BERT, TDR, VNA, Spectrum Analyzer and Probe Station, as well as, C/C++/Perl/Python programming.
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Package Design Engineers
Austin, TX
Full time
Duties: Design, develop and optimize packaging of Integrated Circuits (IC) using APD, XPD, XSI, Integrity Planner, Sigrity, Allegro PCB SI, SIP, etc; Interface and coordinate with multi- functional groups throughout on SiP/Module feasibility analysis, design and selection; Define and develop design verification and automation strategy; Strengthen & streamline package design as well as release flows; Ensure package design is optimized wit SI/PI requirements; Collaborate with R&D & product Validation team to focus on resolving tool defects and enhancements; Develop test strategy on deriving solution, reducing end-to-end delivery time; similar duties.
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Requirements: MS or foreign equivalent in Computer Science or Engineering (any) or Information Systems or Management or Technology or Related and 3 years’ experience including at least 2 years of experience IC packaging, 2.5D, 3D packaging technologies, Allegro Platform tools, Signal Integrity and Power Integrity analysis, DDR and PCIe interfaces (OR) BS or foreign equivalent in Computer Science or Engineering (any) or Information Systems or Management or Technology or Related and 5 years of relevant progressive experience including at least 2 years of experience IC packaging, 2.5D, 3D packaging technologies, Allegro Platform tools, Signal Integrity and Power Integrity analysis, DDR and PCIe interfaces
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Location: Bee Cave, TX
Full Time Roll
Respond to: HR, Chipletz Inc., 13301 Galleria Circle STE B-250, Bee Cave, TX 78738
Positions are eligible for the employee referral program.
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