Chipletz at DesignCon 2026

Last month, we had the honor of presenting some of our work from Chipletz at DesignCon 2026. We've been doing some fascinating work in the area of advanced packaging, and we're grateful for the opportunity to share this work at a conference dedicated to signal and power integrity.

If you're interested in advanced semiconductor packaging, die-to-die interconnects, chiplets and heterogeneous integration, or just signal integrity in general, please check out our work! Our contact information is given right in the paper and slides, so feel free to reach out with any questions.

DC26_PAPER_Track05_EnablingHigh-SpeedDie-to-DieInterfaces_Chipletz.pdf

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DC26_SLIDES_Track05_EnablingHigh-SpeedDie-to-DieInterfaces_Chipletz.pdf

Download PDF • 16.99MB